DP83846AVHG/NOPB
vs
L80225
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
BROADCOM INC
|
| Part Package Code |
QFP
|
|
| Package Description |
12 X 12 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, LQFP-80
|
QCCJ, LDCC44,.7SQ
|
| Pin Count |
80
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Data Rate |
100000 Mbps
|
100000 Mbps
|
| JESD-30 Code |
S-PQFP-G80
|
S-PQCC-J44
|
| JESD-609 Code |
e3
|
e0
|
| Length |
12 mm
|
16.585 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
80
|
44
|
| Number of Transceivers |
1
|
2
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
QCCJ
|
| Package Equivalence Code |
QFP80,.55SQ,20
|
LDCC44,.7SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
225
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
4.57 mm
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
12 mm
|
16.585 mm
|
| Base Number Matches |
1
|
2
|
| Supply Current-Max |
|
0.14 mA
|
|
|
|
Compare DP83846AVHG/NOPB with alternatives
Compare L80225 with alternatives