DP83620SQ/NOPB
vs
AM79C874VC
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ADVANCED MICRO DEVICES INC
|
| Package Description |
WQFN-48
|
TFQFP, QFP80,.55SQ,20
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
5A991.B.1
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Data Rate |
100000 Mbps
|
100000 Mbps
|
| JESD-30 Code |
S-XQCC-N48
|
S-PQFP-G80
|
| JESD-609 Code |
e3
|
e0
|
| Length |
7 mm
|
12 mm
|
| Moisture Sensitivity Level |
2
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
80
|
| Number of Transceivers |
1
|
1
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
TFQFP
|
| Package Equivalence Code |
LCC48,.27SQ,20
|
QFP80,.55SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
1.2 mm
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7 mm
|
12 mm
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
80
|
| Supply Current-Max |
|
0.13 mA
|
|
|
|
Compare DP83620SQ/NOPB with alternatives
Compare AM79C874VC with alternatives