DP5Z4MX16PA3-12B
vs
DP5Z4MX16PA3-15B
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Contact Manufacturer
|
Transferred
|
| Ihs Manufacturer |
TWILIGHT TECHNOLOGY INC
|
DPAC TECHNOLOGIES CORP
|
| Part Package Code |
PGA
|
PGA
|
| Package Description |
APGA, PGA50,5X10
|
APGA, PGA50,5X10
|
| Pin Count |
50
|
50
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
120 ns
|
150 ns
|
| Data Polling |
NO
|
NO
|
| JESD-30 Code |
R-CPGA-P50
|
R-CPGA-P50
|
| Length |
25.146 mm
|
25.146 mm
|
| Memory Density |
67108864 bit
|
67108864 bit
|
| Memory IC Type |
FLASH MODULE
|
FLASH MODULE
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Sectors/Size |
64
|
64
|
| Number of Terminals |
50
|
50
|
| Number of Words |
4194304 words
|
4194304 words
|
| Number of Words Code |
4000000
|
4000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
4MX16
|
4MX16
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
APGA
|
APGA
|
| Package Equivalence Code |
PGA50,5X10
|
PGA50,5X10
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, PIGGYBACK
|
GRID ARRAY, PIGGYBACK
|
| Page Size |
64 words
|
64 words
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Programming Voltage |
5 V
|
5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
38535Q/M;38534H;883B
|
| Seated Height-Max |
11.9888 mm
|
11.9888 mm
|
| Sector Size |
64K
|
64K
|
| Standby Current-Max |
0.0008 A
|
0.0008 A
|
| Supply Current-Max |
0.17 mA
|
0.17 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Toggle Bit |
NO
|
NO
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
13.716 mm
|
13.716 mm
|
| Base Number Matches |
2
|
2
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare DP5Z4MX16PA3-12B with alternatives
Compare DP5Z4MX16PA3-15B with alternatives