DP5Z4MW16PJ3-12I
vs
DP5Z4MX16PJ3-15M
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
DPAC TECHNOLOGIES CORP
DPAC TECHNOLOGIES CORP
Part Package Code
QMA
LCC
Package Description
QCCJ, LDCC48,.51X.88
AQCCJ, LDCC48,.51X.88
Pin Count
48
48
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
120 ns
150 ns
Data Polling
NO
NO
JESD-30 Code
R-XQMA-J48
R-CQCC-J48
JESD-609 Code
e0
e0
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH MODULE
Memory Width
16
16
Number of Functions
1
1
Number of Sectors/Size
64
64
Number of Terminals
48
48
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
4MX16
4MX16
Package Body Material
UNSPECIFIED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCJ
AQCCJ
Package Equivalence Code
LDCC48,.51X.88
LDCC48,.51X.88
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
CHIP CARRIER, PIGGYBACK
Page Size
64 words
64 words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Sector Size
64K
64K
Standby Current-Max
0.0008 A
0.0008 A
Supply Current-Max
0.1 mA
0.17 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Toggle Bit
NO
NO
Type
NOR TYPE
NOR TYPE
Base Number Matches
2
2
Screening Level
MIL-STD-883 Class B (Modified)
Seated Height-Max
10.3886 mm
Compare DP5Z4MW16PJ3-12I with alternatives
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