DP3D8MX32RY5-70C
vs
DPD8MX32RY5-80C
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
DPAC TECHNOLOGIES CORP
|
DPAC TECHNOLOGIES CORP
|
| Package Description |
,
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.24
|
8542.32.00.24
|
| Access Mode |
FAST PAGE
|
FAST PAGE
|
| Access Time-Max |
70 ns
|
80 ns
|
| Additional Feature |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
|
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
|
| JESD-30 Code |
R-XQMA-N66
|
R-XQMA-N66
|
| Memory Density |
268435456 bit
|
268435456 bit
|
| Memory IC Type |
FAST PAGE DRAM MODULE
|
FAST PAGE DRAM MODULE
|
| Memory Width |
32
|
32
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
66
|
66
|
| Number of Words |
8388608 words
|
8388608 words
|
| Number of Words Code |
8000000
|
8000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
8MX32
|
8MX32
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare DP3D8MX32RY5-70C with alternatives
Compare DPD8MX32RY5-80C with alternatives