DM74S182N
vs
N74S182N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
PHILIPS SEMICONDUCTORS
Package Description
PLASTIC, DIP-16
DIP, DIP16,.3
Reach Compliance Code
compliant
unknown
Additional Feature
WITH HIGHER ORDER LOOKAHEAD
Family
S
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e0
e0
Length
19.305 mm
Load Capacitance (CL)
15 pF
Logic IC Type
LOOK-AHEAD CARRY GENERATOR
LOOK-AHEAD CARRY GENERATOR
Number of Bits
4
Number of Functions
1
Number of Terminals
16
16
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
109 mA
Propagation Delay (tpd)
10.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
4
4
HTS Code
8542.39.00.01
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