DM74LS259CW vs MM74HC174MTCX feature comparison

DM74LS259CW Fairchild Semiconductor Corporation

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MM74HC174MTCX Fairchild Semiconductor Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP FAIRCHILD SEMICONDUCTOR CORP
Part Package Code WAFER TSSOP
Package Description DIE, ROHS COMPLIANT, 4.40 MM, MO-153, TSSOP-16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 1:8 DMUX FOLLOWED BY LATCH
Family LS HC/UH
JESD-30 Code X-XUUC-N16 R-PDSO-G16
Logic IC Type D LATCH D FLIP-FLOP
Number of Bits 8 6
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Output Polarity TRUE TRUE
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE TSSOP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 32 ns 206 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 6 V
Supply Voltage-Min (Vsup) 4.75 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Base Number Matches 1 2
Rohs Code Yes
Pin Count 16
JESD-609 Code e3
Length 5 mm
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 21000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP16,.25
Packing Method TR
Seated Height-Max 1.1 mm
Terminal Finish MATTE TIN
Terminal Pitch 0.65 mm
Width 4.4 mm
fmax-Min 24 MHz

Compare DM74LS259CW with alternatives

Compare MM74HC174MTCX with alternatives