Findchips: Compare DM7404CW vs 74LV132BQ,115

DM7404CW vs 74LV132BQ,115 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Active	Transferred
Ihs Manufacturer	ROCHESTER ELECTRONICS LLC	NXP SEMICONDUCTORS
Package Description	DIE,	2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	TTL/H/L	LV/LV-A/LVX/H
JESD-30 Code	R-XUUC-N14	R-PQCC-N14
Logic IC Type	INVERTER	NAND GATE
Number of Functions	6	4
Number of Inputs	1	2
Number of Terminals	14	14
Package Body Material	UNSPECIFIED	PLASTIC/EPOXY
Package Code	DIE	HVQCCN
Package Equivalence Code	DIE OR CHIP	LCC14,.1X.12,20
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	UNCASED CHIP	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Propagation Delay (tpd)	15 ns	43 ns
Supply Voltage-Max (Vsup)	5.25 V	5.5 V
Supply Voltage-Min (Vsup)	4.75 V	1 V
Supply Voltage-Nom (Vsup)	5 V	3.3 V
Surface Mount	YES	YES
Technology	TTL	CMOS
Terminal Form	NO LEAD	NO LEAD
Terminal Position	UPPER	QUAD
Base Number Matches	2	2
Rohs Code		Yes
Part Package Code		QFN
Pin Count		14
Manufacturer Package Code		SOT762-1
JESD-609 Code		e4
Length		3 mm
Load Capacitance (CL)		50 pF
Max I(ol)		0.006 A
Moisture Sensitivity Level		1
Operating Temperature-Max		125 °C
Operating Temperature-Min		-40 °C
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		25 ns
Qualification Status		Not Qualified
Schmitt Trigger		YES
Seated Height-Max		1 mm
Temperature Grade		AUTOMOTIVE
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch		0.5 mm
Time@Peak Reflow Temperature-Max (s)		30
Width		2.5 mm
	Logic » Gates	Logic » Gates