DM54S182J vs N74S182N feature comparison

DM54S182J Rochester Electronics LLC

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N74S182N NXP Semiconductors

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Package Description , DIP, DIP16,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature LG-MAX
Family S S
JESD-30 Code R-CDIP-T16 R-PDIP-T16
Length 19.939 mm 19.09 mm
Load Capacitance (CL) 50 pF
Logic IC Type LOOK-AHEAD CARRY GENERATOR LOOK-AHEAD CARRY GENERATOR
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 14 ns 7 ns
Seated Height-Max 4.572 mm 4.06 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 4 4
Part Package Code DIP
Pin Count 16
JESD-609 Code e0
Output Polarity INVERTED
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)

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