DM54S02J/883
vs
I74F02N
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
PHILIPS SEMICONDUCTORS
Package Description
DIP,
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
S
JESD-30 Code
R-GDIP-T14
R-PDIP-T14
Length
19.43 mm
Logic IC Type
NOR GATE
NOR GATE
Number of Functions
4
Number of Inputs
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
5.5 ns
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
Base Number Matches
3
3
Rohs Code
JESD-609 Code
e4
Max I(ol)
0.02 A
Package Equivalence Code
DIP14,.3
Power Supply Current-Max (ICC)
13 mA
Prop. Delay@Nom-Sup
7 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
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