DM54S00J/883
vs
DM54S00J/883B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
NATIONAL SEMICONDUCTOR CORP
Package Description
DIP,
DIP, DIP14,.3
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
S
JESD-30 Code
R-GDIP-T14
R-XDIP-T14
Length
19.43 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
Number of Inputs
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
5 ns
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
Base Number Matches
3
2
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
DIP14,.3
Power Supply Current-Max (ICC)
36 mA
Prop. Delay@Nom-Sup
5 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Screening Level
38535Q/M;38534H;883B
Terminal Finish
Tin/Lead (Sn/Pb)
Compare DM54S00J/883 with alternatives
Compare DM54S00J/883B with alternatives