DM54LS453J/883
vs
TC74HCT158AF-EL
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TOSHIBA CORP
|
Package Description |
DIP, DIP24,.3
|
SOP,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
OPTEMP SPECIFIED AS TC
|
|
Family |
LS
|
HCT
|
JESD-30 Code |
R-GDIP-T24
|
R-PDSO-G16
|
JESD-609 Code |
e0
|
e0
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Max I(ol) |
0.008 A
|
|
Number of Functions |
4
|
4
|
Number of Inputs |
4
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
24
|
16
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output Polarity |
TRUE
|
INVERTED
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP24,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Power Supply Current-Max (ICC) |
100 mA
|
|
Prop. Delay@Nom-Sup |
40 ns
|
|
Propagation Delay (tpd) |
45 ns
|
45 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
38535Q/M;38534H;883B
|
|
Seated Height-Max |
5.715 mm
|
1.9 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
TTL
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
5.3 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Part Package Code |
|
SOIC
|
Pin Count |
|
16
|
Length |
|
10.3 mm
|
|
|
|
Compare DM54LS453J/883 with alternatives
Compare TC74HCT158AF-EL with alternatives