DM54LS298W
vs
DV74LS298D
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
AVG SEMICONDUCTORS
|
| Package Description |
DFP, FL16,.3
|
SOP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-XDFP-F16
|
|
| JESD-609 Code |
e0
|
|
| Logic IC Type |
MULTIPLEXER
|
|
| Max I(ol) |
0.004 A
|
|
| Number of Functions |
4
|
|
| Number of Inputs |
2
|
|
| Number of Terminals |
16
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC
|
|
| Package Code |
DFP
|
|
| Package Equivalence Code |
FL16,.3
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
FLATPACK
|
|
| Power Supply Current-Max (ICC) |
21 mA
|
|
| Prop. Delay@Nom-Sup |
25 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
TTL
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
FLAT
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Base Number Matches |
4
|
1
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
16
|
|
|
|
Compare DV74LS298D with alternatives