DM54LS298W
vs
54LS298/BFAJC
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Package Description |
,
|
DFP, FL16,.3
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Base Number Matches |
4
|
3
|
Rohs Code |
|
No
|
JESD-30 Code |
|
R-XDFP-F16
|
JESD-609 Code |
|
e0
|
Max I(ol) |
|
0.004 A
|
Number of Functions |
|
4
|
Number of Inputs |
|
2
|
Number of Terminals |
|
16
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
|
CERAMIC
|
Package Code |
|
DFP
|
Package Equivalence Code |
|
FL16,.3
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
FLATPACK
|
Power Supplies |
|
5 V
|
Power Supply Current-Max (ICC) |
|
21 mA
|
Prop. Delay@Nom-Sup |
|
48 ns
|
Qualification Status |
|
Not Qualified
|
Screening Level |
|
38535Q/M;38534H;883B
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
YES
|
Technology |
|
TTL
|
Temperature Grade |
|
MILITARY
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
|
FLAT
|
Terminal Pitch |
|
1.27 mm
|
Terminal Position |
|
DUAL
|
|
|
|