DM54LS151W-MLS
vs
TC74AC158FN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TOSHIBA CORP
Package Description
DFP,
SOP, SOP16,.25
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
AC
JESD-30 Code
R-GDFP-F16
R-PDSO-G16
Length
9.6645 mm
9.9 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
1
4
Number of Inputs
8
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
COMPLEMENTARY
INVERTED
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DFP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
SMALL OUTLINE
Propagation Delay (tpd)
40 ns
10.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.032 mm
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
TTL
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
FLAT
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
6.604 mm
3.9 mm
Base Number Matches
1
1
Rohs Code
No
Part Package Code
SOIC
Pin Count
16
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Package Equivalence Code
SOP16,.25
Prop. Delay@Nom-Sup
10.6 ns
Terminal Finish
Tin/Lead (Sn/Pb)
Compare DM54LS151W-MLS with alternatives
Compare TC74AC158FN with alternatives