DM54LS00J
vs
54F00/B2A
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
PHILIPS SEMICONDUCTORS
Package Description
DIP, DIP14,.3
QCCN, LCC20,.35SQ
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
JESD-30 Code
R-GDIP-T14
S-XQCC-N20
JESD-609 Code
e0
e0
Length
19.43 mm
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.004 A
Number of Functions
4
Number of Inputs
2
Number of Terminals
14
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
QCCN
Package Equivalence Code
DIP14,.3
LCC20,.35SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Power Supply Current-Max (ICC)
4.4 mA
Prop. Delay@Nom-Sup
15 ns
Propagation Delay (tpd)
15 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
7.62 mm
Base Number Matches
4
3
Screening Level
38535Q/M;38534H;883B
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