DM5408W/883
vs
MM74HCT08N
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DFP
|
|
| Package Description |
DFP, FL14,.3
|
DIP, DIP14,.3
|
| Pin Count |
14
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
TTL/H/L
|
HCT
|
| JESD-30 Code |
R-GDFP-F14
|
R-PDIP-T14
|
| JESD-609 Code |
e0
|
e0
|
| Length |
9.5885 mm
|
19.18 mm
|
| Load Capacitance (CL) |
15 pF
|
50 pF
|
| Logic IC Type |
AND GATE
|
AND GATE
|
| Max I(ol) |
0.016 A
|
0.004 A
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DFP
|
DIP
|
| Package Equivalence Code |
FL14,.3
|
DIP14,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
33 mA
|
|
| Prop. Delay@Nom-Sup |
27 ns
|
23 ns
|
| Propagation Delay (tpd) |
19 ns
|
23 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
NO
|
NO
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Seated Height-Max |
2.032 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
FLAT
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
6.35 mm
|
7.62 mm
|
| Base Number Matches |
3
|
5
|
|
|
|
Compare DM5408W/883 with alternatives