DM388AAARD11
vs
XDM385AAR11F
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
LFBGA,
|
LFBGA,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A992.C
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
28
|
28
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
30 MHz
|
30 MHz
|
| External Data Bus Width |
16
|
16
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B609
|
S-PBGA-B609
|
| JESD-609 Code |
e1
|
e1
|
| Length |
16 mm
|
16 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of DMA Channels |
72
|
|
| Number of Terminals |
609
|
609
|
| On Chip Data RAM Width |
8
|
|
| Operating Temperature-Max |
95 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| RAM (words) |
655360
|
|
| Seated Height-Max |
1.32 mm
|
1.32 mm
|
| Speed |
970 MHz
|
970 MHz
|
| Supply Voltage-Max |
1.42 V
|
1.42 V
|
| Supply Voltage-Min |
1.28 V
|
1.28 V
|
| Supply Voltage-Nom |
1.35 V
|
1.35 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
16 mm
|
16 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
3
|
1
|
|
|
|
Compare DM388AAARD11 with alternatives
Compare XDM385AAR11F with alternatives