DM3725CUSD100
vs
AM3703CUS100
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
0.65 MM PITCH, GREEN, PLASTIC, FCBGA-423
14 X 14 MM, 0.65 MM PITCH, GREEN, PLASTIC, BGA-423
Pin Count
423
423
Reach Compliance Code
compliant
compliant
ECCN Code
5A992.C
5A992.C
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
Texas Instruments
Address Bus Width
26
26
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
54 MHz
54 MHz
External Data Bus Width
16
16
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B423
S-PBGA-B423
JESD-609 Code
e1
e1
Length
16 mm
16 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of DMA Channels
128
Number of Terminals
423
423
Operating Temperature-Max
90 °C
90 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA423,24X24,25
BGA423,24X24,25
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
RAM (words)
16384
65536
Seated Height-Max
1.4 mm
1.4 mm
Speed
1000 MHz
1000 MHz
Supply Current-Max
37 mA
740 mA
Supply Voltage-Max
1.2 V
1.2 V
Supply Voltage-Min
1.08 V
0.9 V
Supply Voltage-Nom
1.14 V
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
16 mm
16 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
On Chip Data RAM Width
8
Compare DM3725CUSD100 with alternatives
Compare AM3703CUS100 with alternatives