DM2816AH-300 vs DE5516A-300 feature comparison

DM2816AH-300 LSI Corporation

Buy Now Datasheet

DE5516A-300 LSI Corporation

Buy Now Datasheet
No No
Obsolete Obsolete
SEEQ TECHNOLOGY INC SEEQ TECHNOLOGY INC
DIP, DIP24,.6 DIP, DIP24,.6
unknown unknown
3A001.A.2.C EAR99
8542.32.00.51 8542.32.00.51
300 ns 300 ns
AUTOMATIC WRITE AUTOMATIC WRITE
NO NO
YES YES
10000 Write/Erase Cycles 100000 Write/Erase Cycles
R-GDIP-T24 R-GDIP-T24
e0 e0
16384 bit 16384 bit
EEPROM EEPROM
8 8
1 1
24 24
2048 words 2048 words
2000 2000
ASYNCHRONOUS ASYNCHRONOUS
125 °C 85 °C
-55 °C -40 °C
2KX8 2KX8
CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
DIP DIP
DIP24,.6 DIP24,.6
RECTANGULAR RECTANGULAR
IN-LINE IN-LINE
PARALLEL PARALLEL
5 V 5 V
Not Qualified Not Qualified
5.5 V 5.5 V
4.5 V 4.5 V
5 V 5 V
NO NO
NMOS NMOS
MILITARY INDUSTRIAL
TIN LEAD TIN LEAD
THROUGH-HOLE THROUGH-HOLE
2.54 mm 2.54 mm
DUAL DUAL
NO NO
2 ms 10 ms
1 1

Compare DM2816AH-300 with alternatives

Compare DE5516A-300 with alternatives