DM2223T-12I
vs
DM2233T-20
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ENHANCED MEMORY SYSTEMS INC
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
TSOP2
|
|
Package Description |
TSOP, TSOP44,.36,32
|
TSOP, TSOP44,.36,32
|
Pin Count |
44
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.02
|
8542.32.00.02
|
Access Mode |
FAST EDO/STATIC COLUMN
|
|
Access Time-Max |
30 ns
|
20 ns
|
Additional Feature |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 1K X 8 SRAM
|
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
R-PDSO-G44
|
R-PDSO-G44
|
JESD-609 Code |
e0
|
|
Memory Density |
4194304 bit
|
4194304 bit
|
Memory IC Type |
CACHE DRAM
|
EDO DRAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
|
Number of Ports |
1
|
|
Number of Terminals |
44
|
44
|
Number of Words |
524288 words
|
524288 words
|
Number of Words Code |
512000
|
512000
|
Operating Mode |
ASYNCHRONOUS
|
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
512KX8
|
512KX8
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSOP
|
TSOP
|
Package Equivalence Code |
TSOP44,.36,32
|
TSOP44,.36,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Refresh Cycles |
1024
|
1024
|
Standby Current-Max |
0.001 A
|
0.001 A
|
Supply Current-Max |
0.225 mA
|
0.18 mA
|
Supply Voltage-Max (Vsup) |
5.25 V
|
|
Supply Voltage-Min (Vsup) |
4.75 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
MOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
2
|
|
|
|
Compare DM2223T-12I with alternatives