DL5253B vs MX1N5253AE3 feature comparison

DL5253B Sangdest Microelectronics (Nanjing) Co Ltd

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MX1N5253AE3 Microsemi Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SANGDEST MICROELECTRONICS (NANJING) CO LTD MICROSEMI CORP
Package Description O-LELF-R2 ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-7, 2 PIN
Reach Compliance Code compliant compliant
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.417 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 25 V 25 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Form WRAP AROUND WIRE
Terminal Position END AXIAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Voltage Tol-Max 5% 10%
Working Test Current 5 mA 5 mA
Base Number Matches 4 4
Part Package Code DO-7
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50
JEDEC-95 Code DO-204AA
JESD-609 Code e3
Operating Temperature-Min -65 °C
Terminal Finish MATTE TIN

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