DL5252B-T1
vs
MMSZ5252B
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
MICRO COMMERCIAL COMPONENTS CORP
|
Package Description |
O-LELF-R2
|
PLASTIC PACKAGE-2
|
Reach Compliance Code |
unknown
|
compliant
|
Case Connection |
ISOLATED
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JESD-30 Code |
O-LELF-R2
|
R-PDSO-G2
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Package Body Material |
GLASS
|
PLASTIC/EPOXY
|
Package Shape |
ROUND
|
RECTANGULAR
|
Package Style |
LONG FORM
|
SMALL OUTLINE
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Voltage-Nom |
24 V
|
24 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Form |
WRAP AROUND
|
GULL WING
|
Terminal Position |
END
|
DUAL
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
5.2 mA
|
5.2 mA
|
Base Number Matches |
1
|
5
|
Pbfree Code |
|
No
|
Pin Count |
|
2
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.10.00.50
|
Samacsys Manufacturer |
|
MCC
|
Dynamic Impedance-Max |
|
33 Ω
|
JESD-609 Code |
|
e0
|
Knee Impedance-Max |
|
600 Ω
|
Peak Reflow Temperature (Cel) |
|
240
|
Reverse Current-Max |
|
0.0001 µA
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare DL5252B-T1 with alternatives
Compare MMSZ5252B with alternatives