DL4002
vs
1N4936-GT3
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
| Part Package Code |
MELF
|
|
| Package Description |
MELF-2
|
O-PALF-W2
|
| Pin Count |
2
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.80
|
|
| Additional Feature |
METALLURGICALLY BONDED
|
HIGH RELIABILITY
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.1 V
|
|
| JESD-30 Code |
O-LELF-R2
|
O-PALF-W2
|
| JESD-609 Code |
e0
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Non-rep Pk Forward Current-Max |
30 A
|
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
|
| Output Current-Max |
1 A
|
1 A
|
| Package Body Material |
GLASS
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
100 V
|
400 V
|
| Reverse Recovery Time-Max |
2 µs
|
0.2 µs
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
WRAP AROUND
|
WIRE
|
| Terminal Position |
END
|
AXIAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Base Number Matches |
9
|
2
|
| Application |
|
GENERAL PURPOSE
|
| JEDEC-95 Code |
|
DO-41
|
|
|
|
Compare DL4002 with alternatives
Compare 1N4936-GT3 with alternatives