DL4001
vs
934034540235
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
NXP SEMICONDUCTORS
Part Package Code
MELF
SOT-23
Package Description
MELF-2
PLASTIC, SMD, 3 PIN
Pin Count
2
3
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.80
8541.10.00.70
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
Configuration
SINGLE
COMMON CATHODE, 2 ELEMENTS
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
1.1 V
JESD-30 Code
O-LELF-R2
R-PDSO-G3
JESD-609 Code
e0
e3
Non-rep Pk Forward Current-Max
30 A
Number of Elements
1
2
Number of Phases
1
Number of Terminals
2
3
Operating Temperature-Max
175 °C
150 °C
Output Current-Max
1 A
0.12 A
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
RECTANGULAR
Package Style
LONG FORM
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Rep Pk Reverse Voltage-Max
50 V
Reverse Recovery Time-Max
2 µs
Surface Mount
YES
YES
Terminal Finish
Tin/Lead (Sn/Pb)
Tin (Sn)
Terminal Form
WRAP AROUND
GULL WING
Terminal Position
END
DUAL
Base Number Matches
1
1
Pbfree Code
Application
GENERAL PURPOSE
JEDEC-95 Code
TO-236AB
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Technology
SCHOTTKY
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare DL4001 with alternatives
Compare 934034540235 with alternatives