DG444DVZ-T
vs
DG212EGE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTERSIL CORP
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
SOIC, TSSOP
QFN
Package Description
TSSOP, TSSOP16,.25
HVQCCN, LCC16,.2SQ,32
Pin Count
16, 16
16
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
26 Weeks
Additional Feature
IT CAN ALSO OPERATE WITH 12V SINGLE SUPPLY
Analog IC - Other Type
SPST
SPST
JESD-30 Code
R-PDSO-G16
S-XQCC-N16
JESD-609 Code
e3
e0
Length
5 mm
5 mm
Moisture Sensitivity Level
1
1
Neg Supply Voltage-Max (Vsup)
-20 V
-18 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Channels
1
1
Number of Functions
4
4
Number of Terminals
16
16
Off-state Isolation-Nom
60 dB
70 dB
On-state Resistance-Max (Ron)
85 Ω
175 Ω
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output
SEPARATE OUTPUT
SEPARATE OUTPUT
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TSSOP
HVQCCN
Package Equivalence Code
TSSOP16,.25
LCC16,.2SQ,32
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
0.8 mm
Supply Voltage-Max (Vsup)
20 V
18 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
YES
YES
Switch-off Time-Max
140 ns
500 ns
Switch-on Time-Max
250 ns
1000 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn) - annealed
TIN LEAD
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
0.8 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
5 mm
Base Number Matches
3
1
Pbfree Code
Rohs Code
Neg Supply Voltage-Min (Vsup)
-4.5 V
Normal Position
NO
Supply Voltage-Min (Vsup)
4.5 V
Compare DG444DVZ-T with alternatives
Compare DG212EGE with alternatives