DG419DY+
vs
5962-9073703MPA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
SOIC
DIP
Package Description
0.150 INCH, MS-012A, SOIC-8
DIP, DIP8,.3
Pin Count
8
8
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPDT
SPST
JESD-30 Code
R-PDSO-G8
R-CDIP-T8
JESD-609 Code
e3
e0
Length
4.9 mm
Moisture Sensitivity Level
1
1
Neg Supply Voltage-Max (Vsup)
-20 V
Neg Supply Voltage-Min (Vsup)
-4.5 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
8
8
Off-state Isolation-Nom
68 dB
On-state Resistance Match-Nom
3 Ω
On-state Resistance-Max (Ron)
35 Ω
35 Ω
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SOP
DIP
Package Equivalence Code
SOP8,.25
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
20 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
YES
NO
Switch-off Time-Max
175 ns
145 ns
Switch-on Time-Max
175 ns
175 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
MATTE TIN
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
Base Number Matches
2
1
Screening Level
MIL-STD-883
Compare DG419DY+ with alternatives
Compare 5962-9073703MPA with alternatives