DG417AK/883B
vs
DG417DY+T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
DIP
SOIC
Package Description
DIP, DIP8,.3
SOP, SOP8,.25
Pin Count
8
8
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPST
SPST
JESD-30 Code
R-GDIP-T8
R-PDSO-G8
JESD-609 Code
e0
e3
Moisture Sensitivity Level
1
1
Neg Supply Voltage-Max (Vsup)
-20 V
Neg Supply Voltage-Min (Vsup)
-4.5 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Normal Position
NC
NC
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
8
8
Off-state Isolation-Nom
68 dB
68 dB
On-state Resistance Match-Nom
3 Ω
3 Ω
On-state Resistance-Max (Ron)
30 Ω
35 Ω
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output
SEPARATE OUTPUT
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP8,.3
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
Seated Height-Max
5.08 mm
1.75 mm
Supply Voltage-Max (Vsup)
20 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
YES
Switch-off Time-Max
210 ns
145 ns
Switch-on Time-Max
250 ns
175 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
3.9 mm
Base Number Matches
2
2
Length
4.9 mm
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare DG417AK/883B with alternatives
Compare DG417DY+T with alternatives