DG412FEUE+T vs HI3-0201HS-9 feature comparison

DG412FEUE+T Maxim Integrated Products

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HI3-0201HS-9 Rochester Electronics LLC

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC ROCHESTER ELECTRONICS LLC
Part Package Code TSSOP DIP
Package Description TSSOP, 0.300 INCH, PLASTIC, DIP-16
Pin Count 16 16
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST SPST
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e3 e0
Length 5 mm 19.175 mm
Moisture Sensitivity Level 1 1
Neg Supply Voltage-Max (Vsup) -20 V -20 V
Neg Supply Voltage-Min (Vsup) -4.5 V -4.5 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Channels 1 1
Number of Functions 4 4
Number of Terminals 16 16
Off-state Isolation-Nom 65 dB 72 dB
On-state Resistance Match-Nom 0.2 Ω
On-state Resistance-Max (Ron) 35 Ω 50 Ω
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 4.572 mm
Supply Voltage-Max (Vsup) 20 V 20 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount YES NO
Switch-off Time-Max 145 ns 50 ns
Switch-on Time-Max 175 ns 50 ns
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm 7.62 mm
Base Number Matches 2 2

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Compare HI3-0201HS-9 with alternatives