DG412AK
vs
DG412AK/883
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
SILICONIX INC
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP-16
|
DIP,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-XDIP-T16
|
R-CDIP-T16
|
| JESD-609 Code |
e0
|
|
| Normal Position |
NO
|
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
16
|
| On-state Resistance-Max (Ron) |
100 Ω
|
35 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output |
SEPARATE OUTPUT
|
|
| Package Body Material |
CERAMIC
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
|
| Surface Mount |
NO
|
NO
|
| Switch-on Time-Max |
250 ns
|
400 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
6
|
5
|
| Date Of Intro |
|
2018-07-18
|
| Additional Feature |
|
LG=MAX
|
| Length |
|
21.34 mm
|
| Neg Supply Voltage-Max (Vsup) |
|
-20 V
|
| Neg Supply Voltage-Min (Vsup) |
|
-5 V
|
| Neg Supply Voltage-Nom (Vsup) |
|
-15 V
|
| Number of Channels |
|
1
|
| Screening Level |
|
MIL-STD-883
|
| Seated Height-Max |
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
|
20 V
|
| Supply Voltage-Min (Vsup) |
|
5 V
|
| Supply Voltage-Nom (Vsup) |
|
15 V
|
| Switch-off Time-Max |
|
160 ns
|
| Width |
|
7.62 mm
|
|
|
|