DG309DY-T1-E3
vs
DG309CY
feature comparison
| Pbfree Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
VISHAY SILICONIX
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP, SOP16,.25
|
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Vishay
|
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e3
|
e0
|
| Length |
9.9 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Normal Position |
NC
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
78 dB
|
78 dB
|
| On-state Resistance-Max (Ron) |
100 Ω
|
100 Ω
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output |
SEPARATE OUTPUT
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP16,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
150 ns
|
150 ns
|
| Switch-on Time-Max |
200 ns
|
200 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
|
|
|
Compare DG309DY-T1-E3 with alternatives
Compare DG309CY with alternatives