DG309BDY-T1-E3
vs
DG309CY
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
VISHAY SILICONIX
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP16,.25
SOP-16
Pin Count
16
16
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPST
SPST
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e3
e0
Length
9.9 mm
9.9 mm
Moisture Sensitivity Level
1
1
Neg Supply Voltage-Max (Vsup)
-22 V
-20 V
Neg Supply Voltage-Min (Vsup)
-4 V
-5 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Normal Position
NC
NC
Number of Channels
1
1
Number of Functions
4
4
Number of Terminals
16
16
Off-state Isolation-Nom
90 dB
78 dB
On-state Resistance Match-Nom
1.7 Ω
On-state Resistance-Max (Ron)
85 Ω
100 Ω
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Output
SEPARATE OUTPUT
SEPARATE OUTPUT
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP16,.25
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
22 V
20 V
Supply Voltage-Min (Vsup)
4 V
5 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
YES
YES
Switch-off Time-Max
150 ns
150 ns
Switch-on Time-Max
200 ns
200 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
3.9 mm
Base Number Matches
2
6
Rohs Code
Factory Lead Time
4 Weeks
Compare DG309BDY-T1-E3 with alternatives
Compare DG309CY with alternatives