DG309BDJ-E3
vs
DG309BDJ
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
VISHAY SILICONIX
SILICONIX INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP16,.3
DIP-16
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPST
SPST
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e3
e0
Length
20.13 mm
Moisture Sensitivity Level
1
Neg Supply Voltage-Max (Vsup)
-22 V
Neg Supply Voltage-Min (Vsup)
-4 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Normal Position
NC
NC
Number of Channels
1
Number of Functions
4
4
Number of Terminals
16
16
Off-state Isolation-Nom
90 dB
On-state Resistance Match-Nom
1.7 Ω
On-state Resistance-Max (Ron)
85 Ω
200 Ω
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output
SEPARATE OUTPUT
SEPARATE OUTPUT
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
22 V
Supply Voltage-Min (Vsup)
4 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Switch-off Time-Max
150 ns
Switch-on Time-Max
200 ns
300 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
7.62 mm
Base Number Matches
1
2
Rohs Code