DG307ACK
vs
DG307AK
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
DIP
DIP
Package Description
0.300 INCH, CERDIP-14
DIP, DIP14,.3
Pin Count
14
14
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPDT
SPDT
JESD-30 Code
R-GDIP-T14
R-GDIP-T14
JESD-609 Code
e0
e0
Length
19.43 mm
19.43 mm
Moisture Sensitivity Level
1
Neg Supply Voltage-Max (Vsup)
-18 V
-18 V
Neg Supply Voltage-Min (Vsup)
-5 V
-5 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Channels
1
1
Number of Functions
2
2
Number of Terminals
14
14
Off-state Isolation-Nom
62 dB
62 dB
On-state Resistance-Max (Ron)
50 Ω
50 Ω
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Output
SEPARATE OUTPUT
SEPARATE OUTPUT
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
5 V
5 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Switch-off Time-Max
150 ns
150 ns
Switch-on Time-Max
250 ns
250 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Compare DG307ACK with alternatives
Compare DG307AK with alternatives