DG307ACJ+
vs
HI1-0307-2
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
0.300 INCH, PLASTIC, DIP-14
|
DIP,
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPDT
|
SPDT
|
| JESD-30 Code |
R-PDIP-T14
|
R-GDIP-T14
|
| JESD-609 Code |
e3
|
|
| Length |
19.05 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage-Max (Vsup) |
-18 V
|
|
| Neg Supply Voltage-Min (Vsup) |
-5 V
|
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Channels |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Off-state Isolation-Nom |
62 dB
|
60 dB
|
| On-state Resistance-Max (Ron) |
50 Ω
|
50 Ω
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
4.572 mm
|
|
| Supply Voltage-Max (Vsup) |
18 V
|
|
| Supply Voltage-Min (Vsup) |
5 V
|
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Switch-off Time-Max |
150 ns
|
150 ns
|
| Switch-on Time-Max |
250 ns
|
250 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare DG307ACJ+ with alternatives
Compare HI1-0307-2 with alternatives