DG302ACJ+
vs
DG302BDJ
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
SILICONIX INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP, DIP14,.3
|
,
|
Pin Count |
14
|
14
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Analog IC - Other Type |
DPST
|
|
JESD-30 Code |
R-PDIP-T14
|
|
JESD-609 Code |
e3
|
|
Length |
19.05 mm
|
|
Moisture Sensitivity Level |
1
|
|
Neg Supply Voltage-Max (Vsup) |
-18 V
|
|
Neg Supply Voltage-Min (Vsup) |
-5 V
|
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
|
Number of Channels |
2
|
|
Number of Functions |
2
|
|
Number of Terminals |
14
|
|
Off-state Isolation-Nom |
62 dB
|
|
On-state Resistance-Max (Ron) |
50 Ω
|
|
Operating Temperature-Max |
70 °C
|
|
Operating Temperature-Min |
|
|
Output |
SEPARATE OUTPUT
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
DIP
|
|
Package Equivalence Code |
DIP14,.3
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
IN-LINE
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
4.572 mm
|
|
Supply Voltage-Max (Vsup) |
18 V
|
|
Supply Voltage-Min (Vsup) |
5 V
|
|
Supply Voltage-Nom (Vsup) |
15 V
|
|
Surface Mount |
NO
|
|
Switch-off Time-Max |
250 ns
|
|
Switch-on Time-Max |
300 ns
|
|
Switching |
BREAK-BEFORE-MAKE
|
|
Technology |
CMOS
|
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
7.62 mm
|
|
Base Number Matches |
2
|
2
|
|
|
|
Compare DG302ACJ+ with alternatives
Compare DG302BDJ with alternatives