DG300ACJ
vs
DG300ACK
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
THOMSON CONSUMER ELECTRONICS
|
HARRIS SEMICONDUCTOR
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Base Number Matches |
7
|
6
|
| Rohs Code |
|
No
|
| Package Description |
|
DIP, DIP14,.3
|
| Analog IC - Other Type |
|
SPST
|
| JESD-30 Code |
|
R-GDIP-T14
|
| JESD-609 Code |
|
e0
|
| Neg Supply Voltage-Nom (Vsup) |
|
-15 V
|
| Normal Position |
|
NO
|
| Number of Channels |
|
1
|
| Number of Functions |
|
2
|
| Number of Terminals |
|
14
|
| Off-state Isolation-Nom |
|
62 dB
|
| On-state Resistance-Max (Ron) |
|
50 Ω
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output |
|
SEPARATE OUTPUT
|
| Package Body Material |
|
CERAMIC, GLASS-SEALED
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP14,.3
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Qualification Status |
|
Not Qualified
|
| Supply Voltage-Nom (Vsup) |
|
15 V
|
| Surface Mount |
|
NO
|
| Switching |
|
BREAK-BEFORE-MAKE
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
|
|
|
Compare DG300ACK with alternatives