DG202BDQ-T1-E3
vs
HI3-0549-9
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
VISHAY SILICONIX
HARRIS SEMICONDUCTOR
Part Package Code
TSSOP
Package Description
TSSOP, TSSOP16,.25
DIP-16
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPST
DIFFERENTIAL MULTIPLEXER
JESD-30 Code
R-PDSO-G16
R-PDIP-T16
JESD-609 Code
e3
e0
Length
5 mm
Moisture Sensitivity Level
1
Neg Supply Voltage-Max (Vsup)
-22 V
Neg Supply Voltage-Min (Vsup)
-4.5 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Normal Position
NO
Number of Channels
1
4
Number of Functions
4
1
Number of Terminals
16
16
Off-state Isolation-Nom
90 dB
68 dB
On-state Resistance Match-Nom
2 Ω
126 Ω
On-state Resistance-Max (Ron)
85 Ω
1800 Ω
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output
SEPARATE OUTPUT
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
DIP
Package Equivalence Code
TSSOP16,.25
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
22 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
YES
NO
Switch-off Time-Max
200 ns
1000 ns
Switch-on Time-Max
300 ns
1000 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
4.4 mm
Base Number Matches
1
1
Rohs Code
Additional Feature
OVERVOLTAGE PROTECTION
Signal Current-Max
0.02 A
Supply Current-Max (Isup)
2 mA
Compare DG202BDQ-T1-E3 with alternatives
Compare HI3-0549-9 with alternatives