DG191AP
vs
DG191AP/883
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
VISHAY SILICONIX
|
Package Description |
DIP, DIP16,.3
|
DIP,
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
SPDT
|
SPDT
|
JESD-30 Code |
R-GDIP-T16
|
R-XDIP-T16
|
JESD-609 Code |
e0
|
e0
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Number of Channels |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
16
|
16
|
Off-state Isolation-Nom |
50 dB
|
50 dB
|
On-state Resistance-Max (Ron) |
75 Ω
|
75 Ω
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output |
SEPARATE OUTPUT
|
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
UNSPECIFIED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP16,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
NO
|
NO
|
Switch-off Time-Max |
130 ns
|
130 ns
|
Switch-on Time-Max |
250 ns
|
250 ns
|
Switching |
BREAK-BEFORE-MAKE
|
|
Technology |
JFET
|
BIPOLAR
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
DIP
|
Pin Count |
|
16
|
Additional Feature |
|
FAULT PROTECTED
|
Length |
|
20.32 mm
|
Moisture Sensitivity Level |
|
1
|
Screening Level |
|
MIL-STD-883
|
Seated Height-Max |
|
4.44 mm
|
Width |
|
7.62 mm
|
|
|
|
Compare DG191AP with alternatives
Compare DG191AP/883 with alternatives