DG190AP/883B vs 8100604EX feature comparison

DG190AP/883B General Electric Solid State

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8100604EX Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Transferred Active
Ihs Manufacturer GENERAL ELECTRIC SOLID STATE ROCHESTER ELECTRONICS LLC
Package Description DIP, DIP16,.3 DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPDT DPST
JESD-30 Code R-XDIP-T16 R-CDIP-T16
JESD-609 Code e0
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output SEPARATE OUTPUT
Package Body Material CERAMIC CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Qualified
Screening Level 38535Q/M;38534H;883B
Surface Mount NO NO
Switching BREAK-BEFORE-MAKE
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 4
Part Package Code DIP
Pin Count 16
Neg Supply Voltage-Nom (Vsup) -15 V
Number of Channels 2
On-state Resistance-Max (Ron) 75 Ω
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage-Nom (Vsup) 15 V
Switch-off Time-Max 250 ns
Switch-on Time-Max 375 ns
Technology CMOS
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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