DG182AP
vs
DG381ACJ
feature comparison
Part Life Cycle Code |
Contact Manufacturer
|
Transferred
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
TEMIC SEMICONDUCTORS
|
Package Description |
DIP,
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Analog IC - Other Type |
SPST
|
SPST
|
JESD-30 Code |
R-CDIP-T14
|
R-PDIP-T14
|
Length |
9.585 mm
|
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Number of Channels |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
14
|
14
|
Off-state Isolation-Nom |
50 dB
|
62 dB
|
On-state Resistance-Max (Ron) |
75 Ω
|
50 Ω
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP14,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Seated Height-Max |
5.33 mm
|
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
NO
|
NO
|
Switch-off Time-Max |
130 ns
|
|
Switch-on Time-Max |
250 ns
|
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
7.62 mm
|
|
Base Number Matches |
5
|
3
|
Qualification Status |
|
Not Qualified
|
Supply Current-Max (Isup) |
|
1 mA
|
Technology |
|
CMOS
|
|
|
|