DE28F800B3B115
vs
DE28F800B3T125
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NUMONYX
|
INTEL CORP
|
| Part Package Code |
SSOP
|
SSOP
|
| Package Description |
SSOP-56
|
SSOP-56
|
| Pin Count |
56
|
56
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
19 ns
|
30 ns
|
| Additional Feature |
MINIMUM 100,000 BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK
|
MINIMUM 100,000 BLOCK ERASE CYCLES; TOP BOOT BLOCK
|
| Boot Block |
BOTTOM
|
TOP
|
| JESD-30 Code |
R-PDSO-G56
|
R-PDSO-G56
|
| Length |
23.7 mm
|
23.7 mm
|
| Memory Density |
8388608 bit
|
8388608 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
56
|
56
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
512KX16
|
512KX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
SSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.9 mm
|
1.9 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
13.3 mm
|
13.3 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare DE28F800B3B115 with alternatives
Compare DE28F800B3T125 with alternatives