DE-S1100-CA vs 79RC64V475200DP feature comparison

DE-S1100-CA Intel Corporation

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79RC64V475200DP Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description FQFP, 28 X 28 MM, 3.40 MM HEIGHT, PLASTIC, QFP-208
Pin Count 208 208
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Bit Size 32 64
Boundary Scan NO YES
Clock Frequency-Max 160 MHz 100 MHz
Format FIXED POINT FLOATING POINT
Integrated Cache NO YES
JESD-30 Code S-PQFP-G208 S-PQFP-G208
Length 28 mm 28 mm
Low Power Mode YES YES
Number of Terminals 208 208
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP FQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.75 mm 4.1 mm
Speed 160 MHz 200 MHz
Supply Voltage-Max 2.1 V 3.465 V
Supply Voltage-Min 1.9 V 3.135 V
Supply Voltage-Nom 2 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 28 mm 28 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 14
Rohs Code No
Address Bus Width 64
External Data Bus Width 64
JESD-609 Code e0
Moisture Sensitivity Level 3
Package Equivalence Code QFP208(UNSPEC)
Peak Reflow Temperature (Cel) 225
Supply Current-Max 1400 mA
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 30

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