DB9-USB-F
vs
DB9-USB-M
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
|
FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
|
Part Package Code |
DMA
|
DMA
|
Package Description |
,
|
,
|
Pin Count |
9
|
9
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
FTDI Chip
|
FTDI Chip
|
Address Bus Width |
|
|
Boundary Scan |
NO
|
NO
|
Bus Compatibility |
USB
|
USB
|
Communication Protocol |
ASYNC, BIT
|
|
Data Transfer Rate-Max |
0.375 MBps
|
0.375 MBps
|
External Data Bus Width |
|
|
JESD-30 Code |
R-XDMA-P9
|
R-XDMA-P9
|
Low Power Mode |
NO
|
NO
|
Number of Serial I/Os |
1
|
1
|
Number of Terminals |
9
|
9
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Supply Voltage-Max |
5.25 V
|
5.25 V
|
Supply Voltage-Min |
4.25 V
|
4.25 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
PIN/PEG
|
PIN/PEG
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
Base Number Matches |
1
|
1
|
|
|
|
Compare DB9-USB-F with alternatives
Compare DB9-USB-M with alternatives