DAC8811IBDRBR
vs
AD5543BRM-REEL7
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ANALOG DEVICES INC
|
| Part Package Code |
SON
|
TSSOP
|
| Package Description |
HVSON, SOLCC8,.12,25
|
TSSOP, TSSOP8,.19
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
SERIAL
|
SERIAL
|
| JESD-30 Code |
S-PDSO-N8
|
S-PDSO-G8
|
| Length |
3 mm
|
3 mm
|
| Linearity Error-Max (EL) |
0.0031%
|
0.0031%
|
| Number of Bits |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
TSSOP
|
| Package Equivalence Code |
SOLCC8,.12,25
|
TSSOP8,.19
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
240
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.1 mm
|
| Settling Time-Max |
0.5 µs
|
|
| Settling Time-Nom (tstl) |
0.5 µs
|
0.5 µs
|
| Supply Current-Max |
0.005 mA
|
0.01 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
1
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
Tin/Lead (Sn85Pb15)
|
|
|
|
Compare DAC8811IBDRBR with alternatives
Compare AD5543BRM-REEL7 with alternatives