DAC8412FPZ
vs
MX7528JC/D
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
DIP
|
DIE
|
| Package Description |
ROHS COMPLIANT, PLASTIC, MS-001, DIP-28
|
DIE, DIE OR CHIP
|
| Pin Count |
28
|
20
|
| Manufacturer Package Code |
N-28-2
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
PARALLEL, WORD
|
PARALLEL, 8 BITS
|
| JESD-30 Code |
R-PDIP-T28
|
R-XUUC-N20
|
| JESD-609 Code |
e3
|
e0
|
| Length |
37.4 mm
|
|
| Linearity Error-Max (EL) |
0.0488%
|
0.3906%
|
| Negative Supply Voltage-Nom |
-5 V
|
|
| Number of Bits |
12
|
8
|
| Number of Functions |
4
|
2
|
| Number of Terminals |
28
|
20
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIE
|
| Package Equivalence Code |
DIP28,.6
|
DIE OR CHIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
6.35 mm
|
|
| Settling Time-Nom (tstl) |
10 µs
|
|
| Supply Current-Max |
12 mA
|
1 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
15.24 mm
|
|
| Base Number Matches |
1
|
1
|
| Settling Time-Max |
|
0.4 µs
|
|
|
|
Compare DAC8412FPZ with alternatives
Compare MX7528JC/D with alternatives