DAC80508ZYZFR
vs
DAC80508ZYZFT
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
VFBGA,
|
VFBGA,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2018-08-26
|
2018-08-26
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Analog Output Voltage-Max |
11 V
|
11 V
|
Analog Output Voltage-Min |
|
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY
|
BINARY
|
Input Format |
SERIAL
|
SERIAL
|
JESD-30 Code |
S-PBGA-B16
|
S-PBGA-B16
|
JESD-609 Code |
e1
|
e1
|
Length |
2.39 mm
|
2.39 mm
|
Linearity Error-Max (EL) |
0.0015%
|
0.0015%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Sample Rate |
0.2 MHz
|
0.2 MHz
|
Seated Height-Max |
0.625 mm
|
0.625 mm
|
Settling Time-Max |
5 µs
|
5 µs
|
Settling Time-Nom (tstl) |
5 µs
|
5 µs
|
Supply Voltage-Nom |
5.5 V
|
5.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
2.39 mm
|
2.39 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare DAC80508ZYZFR with alternatives
Compare DAC80508ZYZFT with alternatives