DAC80508MYZFR
vs
DAC80508ZCYZFR
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
VFBGA,
|
VFBGA,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2018-08-26
|
2018-08-26
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Analog Output Voltage-Max |
11 V
|
11 V
|
| Analog Output Voltage-Min |
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
SERIAL
|
SERIAL
|
| JESD-30 Code |
S-PBGA-B16
|
S-PBGA-B16
|
| JESD-609 Code |
e1
|
e1
|
| Length |
2.39 mm
|
2.39 mm
|
| Linearity Error-Max (EL) |
0.0015%
|
0.0015%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Sample Rate |
0.2 MHz
|
0.2 MHz
|
| Seated Height-Max |
0.625 mm
|
0.625 mm
|
| Settling Time-Max |
5 µs
|
5 µs
|
| Settling Time-Nom (tstl) |
5 µs
|
5 µs
|
| Supply Voltage-Nom |
5.5 V
|
5.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
2.39 mm
|
2.39 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare DAC80508MYZFR with alternatives
Compare DAC80508ZCYZFR with alternatives