DAC38RF83IAAV
vs
PDAC38RF82AAV
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
FCBGA-144
|
FBGA,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Date Of Intro |
2016-12-18
|
2017-08-07
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Analog Output Voltage-Max |
2.3 V
|
2.3 V
|
| Analog Output Voltage-Min |
1.3 V
|
1.3 V
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
| Input Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| JESD-30 Code |
S-PBGA-B144
|
S-PBGA-B144
|
| JESD-609 Code |
e1
|
|
| Length |
10 mm
|
10 mm
|
| Moisture Sensitivity Level |
3
|
|
| Negative Supply Voltage-Nom |
-1.8 V
|
-1.8 V
|
| Number of Bits |
14
|
14
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
144
|
144
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FBGA
|
FBGA
|
| Package Equivalence Code |
BGA144,12X12,32
|
BGA144,12X12,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Sample Rate |
9000 MHz
|
|
| Seated Height-Max |
1.94 mm
|
1.94 mm
|
| Settling Time-Nom (tstl) |
0.001 µs
|
0.001 µs
|
| Supply Current-Max |
1758 mA
|
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
10 mm
|
10 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare DAC38RF83IAAV with alternatives
Compare PDAC38RF82AAV with alternatives