DAC3164IRGCR
vs
MAX5873EGK
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
HVQCCN,
|
HVQCCN,
|
| Pin Count |
64
|
68
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Analog Output Voltage-Max |
1 V
|
1.1 V
|
| Analog Output Voltage-Min |
-0.5 V
|
-0.5 V
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
| Input Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| JESD-30 Code |
S-PQCC-N64
|
S-XQCC-N68
|
| JESD-609 Code |
e4
|
e0
|
| Length |
9 mm
|
10 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
68
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Sample Rate |
500 MHz
|
|
| Seated Height-Max |
1 mm
|
0.9 mm
|
| Settling Time-Nom (tstl) |
0.011 µs
|
|
| Supply Current-Max |
59 mA
|
|
| Supply Voltage-Nom |
1.8 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
9 mm
|
10 mm
|
| Base Number Matches |
1
|
2
|
| Qualification Status |
|
COMMERCIAL
|
|
|
|
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